Nitride Powder

Aluminum Nitride AlN Ceramic Microsphere

Item No.:Tr- AlN microsphere
AlN has high thermal conductivity and electrical insulation , add AlN powder into the resin or plastic can significantly improve the thermal conductivity.
    aluminum nitride AlN ceramic microsphere Properties
    AboutAluminum Nitride AlN Ceramic Microsphere:
    AlNCeramic Microsphere has high thermal conductivity (340W) and heat transfer performance after secondary laser melting alloying. Very low oxygen content (lt;0.1%), heat preservation and thermal conductivity effect is very obvious. Used in polymer resin, viscosity is not obvious, is currently a better high thermal conductivity insulation filler.
    陶瓷spherical aluminum nitride was first synthesized in 1877. In the 1980s,AlNCeramic Microsphere, as a Ceramic insulator, has been widely used in the field of microelectronics due to its high heat transferability. Unlike beryllium oxide,AlN陶瓷微球是无毒的。陶瓷spherical aluminum nitride is treated with metal and can be used as a substitute for alumina and beryllium oxide in a large number of electronic instruments. Spherical ceramicAlNcan be prepared by reducing aluminum oxide and carbon or directly nitriding metal aluminum.AlNCeramic Microsphere is a kind of material connected by covalent bonds. It has a hexagonal crystal structure with the same shape as zinc sulfide and wurtzite. Industrial-grade materials can only be made by hot pressing and welding. This material is very stable in an inert high-temperature environment.TRUNNANO is a trusted globalAluminum Nitride AlN Ceramic Microspheresupplier. Feel free to send an inquiry about the latestprice ofAlNCeramicMicrosphereat any time.

    Product Performance of Aluminum Nitride AlN Ceramic Microsphere:
    AlN has high thermal conductivity and electrical insulation , add AlN powder into the resin or plastic can significantly improve the thermal conductivity.

    氮化铝AlN的特性Ceramic Microsphere:
    Near spherical
    High solid loading
    Well flow ability
    Sharp particle size distribution
    High thermal conductivity
    High electrical insulatio

    Specification of Aluminum Nitride AlN Ceramic Microsphere:
    Item Tr-01 Tr-10 Tr-30 Tr-50 Tr-80 Tr-120
    Average Particle Size (um) 1.0-1.2 5-10 20-40 40-60 70-90 110-130
    Particle Shape Near spherical Near spherical Spherical Spherical Spherical Spherical
    True Density (g/cm3) 3.26 3.26 >3.30 >3.30 >3.30 >3.30
    Thermal conductivity (W/m·K) >170 >170 >170 >170 >170 >170
    Bulk Density (g/cm3) 0.3-0.5 1.3-1.5 1.4-1.6 1.6-1.8 1.7-1.9 1.7-1.9
    Tap Density (g/cm3) 0.7-0.9 1.6-1.8 1.8-2.0 1.8-2.0 1.9-2.1 1.9-2.1

    Chemical Composition of Aluminum Nitride AlN Ceramic Microsphere:
    AlN N Fe Mn O C Ca Si Ni
    >99.5% ≥32% 0.04 0.0005 ≤0.42 0.02 ≤0.009 ≤0.045 0.0002

    How isAluminum Nitride AlN Ceramic MicrosphereProduced?
    Spherical aluminum nitride ceramics were prepared by laser flame melting. The product has the advantages of high purity, uniform particle size distribution, clean surface, high sphericity, no residual impurities, easy dispersion and good compatibility with organisms.

    Applications ofAluminum Nitride AlN Ceramic Microsphere:
    1. After the secondary laser melting and spherical alloying, the obtainedAlNCeramic Microsphere has uniform size and good fluidity, which improves the thermal conductivity and insulation of the material;
    2. After melting, the surface ofAlNCeramic Microsphere is treated with resistance to hydrolysis and oxidation, and the thermal conductivity exists for a long time after addition.
    3. Ceramic spherical aluminum nitride has good injection molding performance; Used in composite materials, it has a good match with semiconductor silicon and good interface compatibility, which can improve the mechanical properties and thermal conductivity of composite materials;
    4. Application in high thermal conductivity plastics: ModifiedAlNCeramic Microsphere can greatly improve the thermal conductivity of plastics. At present, it is mainly used in PVC plastics, polyurethane plastics, PA plastics, PP plastics, functional plastics, etc.

    Storage Condition of Aluminum Nitride AlN Ceramic Microsphere:
    The damp reunion will affect aluminum nitride (AlN) ceramic microsphere dispersion performance and using effects, therefore, aluminum nitride (AlN) ceramic microsphere should be sealed in vacuum packing and stored in a cool and dry room, the aluminum nitride (AlN) ceramic microsphere can not be exposure to air. In addition, the aluminum nitride (AlN) ceramic microsphere should be avoided under stress.

    Packing & Shipping of Aluminum Nitride AlN Ceramic Microsphere:
    We have many different kinds of packing which depend on the aluminum nitride (AlN) ceramic microsphere quantity.
    Aluminum nitride (AlN) ceramic microsphere packing:vacuum packing, 100g, 500g or 1kg/bag, 25kg/barrel, or as your request.
    Aluminum nitride (AlN) ceramic microsphere shipping:could be shipped out by sea, by air, by express as soon as possible once payment receipt.

    Aluminum Nitride Microsphere Properties

    Other Names Aluminium nitride
    CAS No. 24304-00-5
    Compound Formula AlN
    分子量 40.9882
    Appearance White to pale yellow powder
    Melting Point 2200 °C
    Boiling Point 2517 °C (dec.)
    Density 2.9 to 3.3 g/cm3
    Solubility in H2O N/A
    Electrical Resistivity 10 to 12 10x Ω-m
    Poisson's Ratio 0.21 to 0.31
    Specific Heat 780 J/kg-K
    Thermal Conductivity 80 to 200 W/m-K
    Thermal Expansion 4.2 to 5.4 µm/m-K
    Young's Modulus 330 GPa
    Exact Mass 40.9846
    Monoisotopic Mass 40.9846

    Aluminum Nitride Microsphere Health & Safety Information

    Remarks Danger
    Hazard Statements H314-H335
    Hazard Codes Xi
    Risk Codes 36/37/38
    Safety Statements 26-37/39
    RTECS Number N/A
    Transport Information N/A
    WGK Germany 3

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